{ "Header": { "GenerationSoftware": { "Vendor": "KiCad", "Application": "Pcbnew", "Version": "7.0.8-7.0.8~ubuntu22.04.1" }, "CreationDate": "2023-10-24T12:18:41+02:00" }, "GeneralSpecs": { "ProjectId": { "Name": "BATConcho", "GUID": "42415443-6f6e-4636-986f-2e6b69636164", "Revision": "rev?" }, "Size": { "X": 68.73, "Y": 53.49 }, "LayerNumber": 2, "BoardThickness": 1.6, "Finish": "None" }, "DesignRules": [ { "Layers": "Outer", "PadToPad": 0.0, "PadToTrack": 0.0, "TrackToTrack": 0.2, "MinLineWidth": 0.4, "TrackToRegion": 0.508, "RegionToRegion": 0.508 } ], "FilesAttributes": [ { "Path": "BATConcho-F_Cu.gtl", "FileFunction": "Copper,L1,Top", "FilePolarity": "Positive" }, { "Path": "BATConcho-B_Cu.gbl", "FileFunction": "Copper,L2,Bot", "FilePolarity": "Positive" }, { "Path": "BATConcho-F_Silkscreen.gto", "FileFunction": "Legend,Top", "FilePolarity": "Positive" }, { "Path": "BATConcho-B_Silkscreen.gbo", "FileFunction": "Legend,Bot", "FilePolarity": "Positive" }, { "Path": "BATConcho-F_Mask.gts", "FileFunction": "SolderMask,Top", "FilePolarity": "Negative" }, { "Path": "BATConcho-B_Mask.gbs", "FileFunction": "SolderMask,Bot", "FilePolarity": "Negative" }, { "Path": "BATConcho-Edge_Cuts.gm1", "FileFunction": "Profile", "FilePolarity": "Positive" } ], "MaterialStackup": [ { "Type": "Legend", "Name": "Top Silk Screen" }, { "Type": "SolderPaste", "Name": "Top Solder Paste" }, { "Type": "SolderMask", "Color": "Green", "Thickness": 0.01, "Name": "Top Solder Mask" }, { "Type": "Copper", "Thickness": 0.035, "Name": "F.Cu" }, { "Type": "Dielectric", "Thickness": 1.51, "Material": "FR4", "Name": "F.Cu/B.Cu", "Notes": "Type: dielectric layer 1 (from F.Cu to B.Cu)" }, { "Type": "Copper", "Thickness": 0.035, "Name": "B.Cu" }, { "Type": "SolderMask", "Color": "Green", "Thickness": 0.01, "Name": "Bottom Solder Mask" }, { "Type": "SolderPaste", "Name": "Bottom Solder Paste" }, { "Type": "Legend", "Name": "Bottom Silk Screen" } ] }